Advotech’s modern metrology equipment is now available providing fast, precise, non-contact 3D measurements. Test your circuit’s reliability in environmental chambers with temperature cycling from -40°C to 150°C. Our new X-ray equipment can analyze die attachment and placement, wire bonds, solder balling, and other tough to visually inspect electrical and mechanical components used in assembly. Using the latest test equipment our technicians can bench test your products at any stage of the design process to assure quality. Process monitoring our die shear, wire pull, and ball shear provides consistent, documented results.