What we do

Dicing Services

Wafer Mid Dicing
Who we are
Dicing

Besides volume processing, we specialize in prototypes and proof-of-concept. We are experienced at dicing semiconductor wafers, multi-project wafers, and individual reticles for maximum yield. Additionally, we can support a wide variety of materials:


  • Silicon
  • Glass
  • Quartz
  • Sapphire
  • Ceramic
  • BGAs
  • FR4
  • Flex circuits
  • Plastics
  • MEMs