What we do

Dicing Services

Wafer Mid Dicing
Who we are

Besides volume processing, we specialize in prototypes and proof-of-concept. We are experienced at dicing semiconductor wafers, multi-project wafers, and individual reticles for maximum yield. Additionally, we can support a wide variety of materials:

  • Silicon
  • Glass
  • Quartz
  • Sapphire
  • Ceramic
  • BGAs
  • FR4
  • Flex circuits
  • Plastics
  • MEMs

Dicing Specifications
Max wafer Size: 8 inch round or square
Spindle Size: 2 inch
Spindle speeds: 3,000 to 60,000 rev/min
Dicing speed: 0.1-500mm/sec
Performs cutting, dicing and scribing operations