Services include wire pull up to 100g, die shear up to 100Kg and BGA & ball bond shear. These tests can be conducted at destruct or non-destruct levels.
Temperature capability of -40C to 150C. Large chambers and multiple systems.
Die sorting from wafers up to 8.0” or 200mm. Diced die can be placed into waffle packs or Gel Paks.
Specialized patterns for die attach, clear or black glob top for bonded wire protection, or flip chip underfill.
Prototype to Medium Volume LED and MEMs assemblies including flex circuits & custom devices.