Who we are
We have the equipment and know-how to accomplish even the most difficult wire bonding applications. If your product is still in the design stage, we encourage you to contact us for suggestions for designing for manufacturability.
- Ball Bonding - gold, copper, and silver wire - down to 35μm pitch
- Wedge bonding - Au or Al wire up to 50μm wire diameter
- Au stud bumping
- Au ribbon bonding
We can wire bond to various substrates including ceramic, PCBs, flex circuits, and modules. Please contact us for surface finish requirements.