|
To meet and exceed our customers’ expectations is our ever present and challenging goal. Advotech offers a wide range of assembly services to accommodate your packaging requirements. With our advanced technology and experienced personnel, Advotech can help overcome even the most complex challenges.
ASSEMBLY CAPABILITIES:
- Die Attach – Epoxy or Eutectic
- Wedge & Ball Bonding – Aluminum or Gold
- Glob Top Dispensing
- Stud Bumping – Individual die service available
- Flip Chip Placement
- Heavy Wire or Ribbon Bonding
TESTING CAPABILITIES:
- Die & Ball Shear Testing
- Wire Pull
- Visual Inspection
- Optical Measurement
ASSEMBLY EQUIPMENT :
Die Attach Equipment
- ESEC Micron 2 - 5 micron placement accuracy
- S.E.C 850 Flip Chip Bonders - 15 micron placement accuracy
- Hybond Eutectic Die Bonder - 15 micron placement accuracy
Automatic Wirebonding Equipment
- Oerlikon/ESEC 3100 Optima Bonder - 33 micron bond pitch
- K&S Maxum Ball Bonders - 35 micron bond pitch
- ESEC 3018 & 3006 - 65 micron bond pitch
Manual Wirebomding Equipment
- K&S 4526 - Manual Wedge Bonder
- K&S 4522 - Deep Access Maual Ball Bonder
- K&S 4123 - Maual Wedge Bonder
- K&S 4124 - Maual Ball Bonder
- Mech-EI 909 - 60 degree Wedge Bonder
Other Assembly Support Equipment
- Semi-Automatic Pick and Place Unit - Waffle Packs, Gel Pak or Tape
- March Plasma Cleaner
- Sikama Falcon 5C Reflow Oven
- Fisher Scientific Extreme High Temp Oven
MULTIPLE PACKAGE TYPES:
- RFID
- Hybrids
- IC
- Photonics
- RF
- MEMS
|
|
ASSEMBLY ROOM
MICRON II DIE BONDER
AUTOMATIC WIRE BONDING
PROTOTYPE MANUAL WIRE BONDING
|
