ASSEMBLY CAPABILITIES:
Die Attach – Epoxy or Eutectic
Wedge & Ball Bonding – Aluminum or Gold
Glob Top Dispensing
Stud Bumping – Individual die service
Flip Chip Placement
TESTING CAPABILITIES:
Die & Ball Shear Testing
Wire Pull
Visual Inspection
Optical Measurement
ASSEMBLY EQUIPMENT:
Die Attach
ESEC Micron 2 - 5 micron placement accuracy
S.E.C 850 Flip Chip Bonders - 15 micron placement accuracy
Hybond Eutectic Die Bonder - 15 micron placement accuracy
Automatic Wirebonding Equipment
Oerlikon/ESEC 3100 Optima Bonder - 33 micron bond pitch
ESEC 3018 & 3006 - 65 micron bond pitch
Manual Wirebonding Equipment
K&S 4526 - Manual Wedge Bonder
K&S 4522 - Deep Access Maual Ball Bonder
K&S 4123 - Manual Wedge Bonder
K&S 4124 - Manual Ball Bonder
Mech-EI 909 - 60 degree Wedge Bonder
Other Assembly Support Equipment
Semi-Automatic Pick and Place Unit - Waffle Packs, Gel Pak or Tape
March Plasma Cleaner
Sikama Falcon 5C Reflow Oven
Fisher Scientific Extreme High Temp Ovens
To meet and exceed our customers’ expectations is our ever present and challenging goal. Advotech offers a wide range of assembly services to accommodate your packaging requirements. With our advanced technology and experienced personnel, Advotech can help overcome even the most complex challenges.